1. 2. 3. material content data sheet sales product name esd8v0r1b-02ls e6327 issued 29. august 2013 ma# MA000866712 package pg-tsslp-2-1 weight* 0.15 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.017 11.09 11.09 110884 110884 leadframe non noble metal nickel 7440-02-0 0.036 24.43 24.43 244305 244305 wire noble metal gold 7440-57-5 0.003 1.86 1.86 18554 18555 encapsulation organic material carbon black 1333-86-4 0.001 0.55 5488 plastics epoxy resin - 0.011 7.41 74070 inorganic material silicondioxide 60676-86-0 0.070 46.90 54.86 469109 548667 leadfinish noble metal gold 7440-57-5 0.004 2.76 2.76 27630 27630 plating noble metal silver 7440-22-4 0.007 5.00 5.00 49960 49960 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
